Molded Interconnect Devices Market size predicted to grow with 13.8% CAGR to hit USD 629.5 million by 2023 - PowerPoint PPT Presentation

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Title: Molded Interconnect Devices Market size predicted to grow with 13.8% CAGR to hit USD 629.5 million by 2023


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Molded Interconnect Devices Market size predicted
to grow with 13.8 CAGR to hit USD 629.5 million
by 2023 Global Market Insights Inc.
Fuel Cell Market size worth 25.5bn by 2024
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Key Insights from Molded Interconnect Devices
Market
  • Automotive molded interconnect devices market is
    forecast to grow at 14.8 CAGR from 2016 to 2023.
    It is expected to be valued at over USD 75
    million by 2023. Surging implementation of these
    devices in brake-light fixtures is expected to
    propel growth.
  • Two-shot molding MID market is estimated to be
    valued at over USD 490 million by 2023. High
    tooling costs involved in this procedure is
    projected to negatively impact the industry.
  • These products offer wide range of application in
    numerous industry segments such as
    telecommunications, automotive electronics,
    domestic appliances, medical equipment and
    computers. In terms of product, these devices
    have found implementation from joysticks to cell
    phones, flashlights to antennas and cars to
    airplanes.

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Continued...
  • Complex production process is likely to challenge
    molded interconnect devices (MID) market size
    through 2023. Two shot molding process results in
    high tooling cost during manufacturing, and this
    is likely to hamper demand. As a result, this
    process finds application mainly in high volume
    production.
  • Asia Pacific molded interconnect device market
    share is estimated to witness growth and hit USD
    505 million by 2023, growing at 14.3 CAGR from
    2016 to 2023. It is forecast to be the most
    attractive regional industry. China is
    anticipated to be the key region, owing to
    availability of low priced components across the
    region.
  • North America and Europe are forecast to be
    driven by steady demand across end-use sectors.
  • Major players operating in the industry are
    Molex, Harting Technology Group, TE Connectivity,
    MacDermid, SelectConnect Technologies, LPKF, RTP
    Company, etc.

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China molded interconnect device market size, by
application, 2012-2023 (USD Million)

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Browse Full Market Research Report of Molded
Interconnect Devices MarketĀ _at_ http//goo.gl/PDoFZ
K Request for a Sample of this Research report
_at_ https//www.gminsights.com/request-sample/detail
/424
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360 Analysis
  • Application Analysis
  • Telecommunication application accounted for more
    than 60 of the global revenue in 2015, and is
    poised to grow at 13.6 CAGR from 2016 to 2023.
    The growth can be primarily attributed to
    increasing usage in antennas. Automotive is
    forecast to witness the fastest growth in the
    coming years at 14.8 CAGR, owing to increasing
    product adoption in brake-light fixtures.
  • Regional Analysis
  • Asia Pacific molded interconnect devices market
    size was valued at over USD 175 million in 2015.
    Growth across the region can be mainly credited
    to availability of low priced components in
    China.
  • Europe MID market share is expected to exhibit
    potential growth owing presence of large number
    of automotive industries across the region. The
    regional industry was valued at USD 24 million in
    2015 and is projected to grow at 12.2 CAGR from
    2016 to 2023.
  • Competitive Market Share
  • Key industry participants accumulating major
    molded interconnect device market share include
    Molex, TE Connectivity and Harting Technology
    Group. Other notable players are MacDermid
    Incorporated, LPKF Laser Electronics,
    SelectConnect Technologies, and RTP Company.


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