Molded Interconnect Devices (MID) Market Size worth USD 629.5 Million by 2023: Global Market Insights, Inc. - PowerPoint PPT Presentation

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Title: Molded Interconnect Devices (MID) Market Size worth USD 629.5 Million by 2023: Global Market Insights, Inc.

Molded Interconnect Devices (MID) 2016 2023
Global Market Scenario of Molded Interconnect
Devices (MID)
  • Molded interconnect devices (MID) market
    size was valued at over USD 225 million in 2015,
    with 13.8 CAGR growth forecast from 2016 to
    2023. Higher function density and design
    flexibility is anticipated to propel industry
  • Molded interconnect devices enable integration
    of mechanical and electronic components and
    circuits directly on 3D (three-dimensional)
    plastic components.
  • This helps in integrating chips elegantly with
    their assemblies, and also allows the antennae in
    smartphones or notebooks to be installed directly
    within the housing. This in turn facilitates in
    saving a great amount of space and
  • These products offer high level of design
    freedom and also exhibit less assembly steps when
    compared to conventional printed circuit boards
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  • Furthermore, integration of functions and
    sensors aids in reducing assembly times as well
    as number of production steps. This is expected
    to optimize the supplementary costs and also
    facilitate in manufacturing high quality
  • Technique such as direct bare chip assembly on
    substrates is anticipated to further fuel
    industry demand over the forecast period. 
  • Selective metallization offered by these products
    is expected to drive MID market size over the
    next seven years.
  • High reliability as a result of low failure ratio
    can be attributed to low degree of complexity of
    the systems due to existence of very less number
    of auxiliary components. They also have superior
    environmental benefits as it uses thermoplastic
    materials with minimal additives.
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China molded interconnect device market size, by
application, 2012-2023 (USD Million)

360 Analysis
  • Application Analysis
  • Telecommunication application accounted for more
    than 60 of the global revenue in 2015, and is
    poised to grow at 13.6 CAGR from 2016 to 2023.
    The growth can be primarily attributed to
    increasing usage in antennas. Automotive is
    forecast to witness the fastest growth in the
    coming years at 14.8 CAGR, owing to increasing
    product adoption in brake-light fixtures.
  • Regional Analysis
  • Asia Pacific molded interconnect devices market
    size was valued at over USD 175 million in 2015.
    Growth across the region can be mainly credited
    to availability of low priced components in
  • Europe MID market share is expected to exhibit
    potential growth owing presence of large number
    of automotive industries across the region.  
  • Competitive Market Share
  • Key industry participants accumulating major
    molded interconnect device market share include
    Molex, TE Connectivity and Harting Technology
    Group. Other notable players are MacDermid
    Incorporated, LPKF Laser Electronics,
    SelectConnect Technologies, and RTP Company.  


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